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Albert Theuwissen posts a short overview of Day 1 in International Image Sensor Workshop being held these days in Snowbird, UT. There were talks about small pixels, noise, and dark current.

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Lucid Vision Labs publishes a very nice animated explanation of how Sony IMX586 ToF sensor works inside Lucid's Helios camera:

"The IMX556 utilizes a current assisted photonic demodulator (CAPD) pixel structure that samples incoming light synchronously with emitted light modulation. CAPD allows for an alternating voltage inside each pixel’s photodiode, creating drift fields that divide and pull electrons to alternating detector junctions."

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Charbax publishes an interview with Avi Strum responsible for TowerJazz image sensor business:

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iClarified quotes Telegraph.co.uk report that Apple stops working on Quantum Dot image sensor and does not extend a contract with Manchester, UK-based Nanoco supplying the QD materials. Apple "has now informed Nanoco that the project will not continue beyond the current contract, for reasons wholly unconnected to the performance of our materials and our service delivery."

Apple was expected to use the QD technology in a future iPhone image sensor that could have debuted as early as this year.

Thanks to JB for the pointer!

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Corning announces that it has delivered its 2 millionth Corning Varioptic liquid lens for industrial applications.

“Varioptic became a part of Corning in 2017 through an acquisition that included Varioptic and Invenios technologies,” said John Duke, VP and GM, Corning Glass Microsystems. “We believe the synergies from this acquisition will lead to exciting new liquid lens application opportunities and the advancement of our Microsystems business.”

This milestone was driven by an increased demand for liquid lenses, particularly as a variety of industries integrate them into manufacturing and warehouse operations. This achievement strengthens Varioptic’s position as a leader in liquid lens solutions for machine vision, barcode readers, medical imaging, and other industrial applications that require robust, accurate, fast-focusing, and long-lasting lenses.

“Our manufacturing capacity nearly doubled in 2018, enabling us to produce liquid lenses at a higher volume than ever before,” said Frédéric Laune, business manager, Corning Varioptic Lenses. “Our ability to innovate paid off with sales doubling in the last two years.”

Varioptic lenses have no moving parts and feature electrowetting technology that uses electrostatic forces to change the radius of the spherical interface between two immiscible liquids. They also enable exceptional shock and vibration resistance, which is essential for current and future applications.

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PRNewswire: OmniVision announces the OS04A10, a 2.9um pixel sensor with 4MP resolution, the latest addition to its growing family of Nyxel NIR and ultra-low light (ULL) sensors. The OS04A10 with QE is 60% at 850nm and 40% at 940nm, said to be 3x to 5x better than sensors without this technology.

"In addition to requiring top performance in all lighting conditions, security and surveillance camera designers are demanding higher resolution for greater facial recognition accuracy with longer zoom range," said Brian Fang, business development director at OmniVision. "By combining our industry-leading NIR and ULL technologies with 4 MP resolution, the OS04A10 is designed to meet the evolving needs of security and surveillance systems."

The amount of NIR light that a sensor requires to capture high quality images can be quantified with a new metric called NIR SNR1, which takes into account the QE, pixel size and read noise. The OS04A10 is said to achieve industry leading SNR1850nm and SNR1940nm performance, which is 2x to 3x smaller when compared with the leading known available competitor sensors.

The OS04A10 is said to also achieve the industry's lowest SNR1 while producing 4 MP and 1080p images for video recording. Additionally, OmniVision's dual-conversion-gain pixel provides good ULL and HDR performance. The 3-frame staggered shutter also minimizes motion artifacts and enables an HDR of 120 dB.

This image sensor is available in an extremely small package enabled by PureCel-S die stacking technology. The PureCel-S technology also reduces power consumption.

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PRNewswire: Canon Inc is pursuing development of the 3U3MRXSAAC, a 2.8MP, 1/2.32-inch CMOS sensor for HDR imaging in -40C to 105C temperature range.

"As Canon evolves in the sensor market, we are dedicated to utilizing our expertise to develop products built to meet current growing market trends," said Kazuto Ogawa, president and COO, Canon U.S.A., Inc. "The 3U3MRXSAAC CMOS sensor under development reflects the continuation of our business strategy that leverages the high-quality imaging technology Canon is able to achieve."

The 3U3MRXSAAC CMOS sensor is expected to achieve a DR of 120 dB at low noise levels. Even during normal drive operation, the sensor can achieve a dynamic range of 75 dB—greater than the sensors on many conventional digital cameras.

Additionally, the 3U3MRXSAAC CMOS sensor will also be capable of operating in environments with extreme temperatures ranging from -40C to 105C. Typically, in high-temperature conditions, the increase in dark current noise can affect the quality of the image. However, the 3U3MRXSAAC CMOS sensor will be equipped with functionality that helps correct black levels in real-time to help maintain high image quality.

The 3U3MRXSAAC CMOS sensor will feature a pixel size of 3.2 μm x 3.2 μm and a frame rate of up to 60 fps (30 fps during HDR drive operation). The sensor will be compatible with the MIPI CSI-2 interface.

PRNewswire: Canon re-announces its 35MMFHDXSMA, a 19um-large pixel 2.7MP sensor, and 120MXSI, a 2.2um 120MP APS-H sized sensor. Both sensors have been already presented earlier, albeit with slightly different part codes. It's not immediately clear what has changed in these new sensors.

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Delft University publishes a PhD thesis "Modular time-of-flight image sensor for light detection and ranging: A digital approach to LIDAR" by Augusto Ronchini Ximenes. Other than overview of the stacked SPAD chips and their components, the thesis has a nice system level model of a LiDAR, probably showing the problem that Fastree3D LiDAR startup dealing with.

The defense of the thesis is scheduled on July 12, so that it leaves enough time for critics.

"Direct time-of-flight (dTOF), specifically, requires more elaborate detectors and data processing, but it has the potential of reaching much longer distances at higher speed and accuracy, with the advantage of being robust to high background noise, making it suitable for space, automotive and consumer applications. One known drawback of dTOF, however, is data volume. For instance, automotive applications require over 100m range, only few centimeters accuracy, and multiple measurements for a reasonable precision, which produce data rates that can reach tens or even hundreds of Gbps, in large sensors, thus setting processing constraints to even very efficient GPUs, as well as chip readout capability. It is essential to provide as much on-chip processing as possible, in order to reduce data throughput, thus reducing power consumption and speeding up processing time. Some architectures have been proposed attempting to solve this problem, but the required memory renders them only feasible for an SiPM, single-pixel approach. Another known issue with light detection and ranging (LiDAR) is regarding the interference of multiple systems on each other. A software-based approach has been implemented, but requiring intensive post-processing resources. In this thesis, a novel approach for on-chip processing is proposed. With the use of cutting-edge 3D-stacking technologies, more flexibility and computational power can be spent on the chip, while not compromising fill factor. A novel proposal for dealing with external interferes is introduced, as well as novel phase/frequency locking solution at the sensor level, as a reference for timing measurements."


The system model of LiDAR analyses coincidence detection approach to remove sunlight for both scanning LiDAR (Condition 1) and flash one (Condition 2). The results show how difficult it is to achieve a long detection range on sunny days:

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X-FAB Silicon Foundries announces the availability of APD and SPAD devices for implementation in the company’s 180nm high-voltage XH018 process. The APD has a high linear gain, and is fully scalable - going from just ten to several hundred micrometer dimensions. The proprietary X-FAB quenching circuit used in the SPAD results in a dead time of less than 15ns. In addition, its low dark count rate (less than 100 counts/s/µm²) means that it is less susceptible to thermal noise. The PDP of the SPAD is maintained across a wide range of wavelengths (e.g. 40% at 400nm). Furthermore, the low breakdown voltage (less than 20V) that has been achieved.

The X-FAB APD and SPAD can be utilized in a broad spectrum of different applications - including proximity sensing, LiDAR, time of flight (ToF), medical imaging (CT and PET) and scientific research. Being AEC-Q100 compliant, they are suitable for deployment within automotive systems.

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Entropix CEO Nathan Wheeler presents his resolution enhancement approach for security cameras:




Bo Zhu, CTO of BlinkAI, presents its AI algorithms for low-light and HDR imaging:

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Counterpoint Research article talks about smartphone camera resolution:

"The trend of smartphone OEMs increasing the camera megapixels (MP) was clear in Q1 2019. According to Counterpoint Research’s data, smartphones with cameras of more than 12MP accounted for over 82% of the total shipments in Q1 2019.

During the quarter, the ratio of smartphones equipped with higher than 40MP rear camera reached nearly 3.6%, due to the increasing adoption of 48MP (0.8µm), which was applied in HONOR V20 and then widely used as the main camera within the triple camera setup.

In spite of a slight decrease in market share, the ratio of the 12~13MP camera remained over 57%. The massive adoption of 12MP is attributable to the trend of pursuing high-quality image, leveraging the relatively larger pixel size (1.22/1.4/1.55µm).

However, the share of 16~18MP was flat as compared to the previous quarter, while the ratio of smartphones equipped with an 8MP(or less) camera has been decreasing.

Samsung LSI just launched a new image sensor with resolution up to 64MP, aiming at the fall release cycle of smartphone flagships. This will further raise the level and quality of smartphone cameras, also resulting in an increased Bill of Materials (BoM) share."

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Bulgaria-based image sensor startup Photolitics is proud to announce that Guy Meynants has recently joined the management team of the young company focusing on speciality image sensor designs such as high speed linescan sensors, medical image sensors and highspeed imaging. Guy Meynants has been one of the first CMOS image sensor designers in Europe, starting with this “art” in 1994 at IMEC where he contributed amongst other to the first Web-cam flying to Mars, which is still sending images from its orbit around the red planet today (see https://mobile.twitter.com/esamarswebcam).

Guy was co-founder of Fillfactory which now is part of ON Semiconductor. In 2007, Guy co-founded CMOSIS and served as its CEO until 2009 when he became CTO and after AMS acquired CMOSIS he served as Engineering Fellow. Guy has always been working on image sensor design and technology development. He developed image sensors for SLR, space and industrial machine vision applications. He authored 60 publications and 30+ patent applications in the field. He is also board member and secretary of the International Image Sensor Society, an organisation to serve the CIS R&D community.

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Yole publishes its webcast on AI in automotive applications. Xilinx has joned the second part of the webcast:

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Crunchbase publishes an article "Consolidation In The Lidar Market May Be Coming" quoting Scott Burroughs, the co-founder and CEO of Sense Photonics:

"...there are about 70 to 80 companies that have attempted to enter the lidar market. Some have succeeded, some have died because they can’t get venture capital, and some are in stealth, he said.

Citing companies like Innoviz Technologies, VeloDyne, and Ouster, he added that he thinks “only a handful of lidar companies will be around in a couple years.”

When he started the company two years ago, he said the focus was on long-range lidar. Now, he said, there are different segments within the automation market, as different types of sensors can be applied to varied use-cases, whether it’s night sight or cutting through the fog.

“It used to be mostly for highway driving,” now there are lots of other segments and different cost points, he said. “Some companies will succeed going after the easy ones” like facial recognition, for example."

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Sony image sensor spin-off presentation quotes some interesting market data from Japan-based Techno Systems Research:

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BusinessWire: Activist investor Third Point Highlights publishes explanations of its proposal to spin-off Sony image sensor business, opens A Stronger Sony dedicated web site promoting that, and publishes a 102-page long presentation with a lot of interesting market data, primarily from TSR.

The presentation gives a nice definition of image sensor on slide 27:

"Image sensor is an analog semiconductor with average price of $2 that processes light from the outside world and transforms those wavelengths into 1s and 0s."

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PRNewswire: OmniVision announces the OV48B, its first 48MP image sensor featuring a 0.8um pixel built on OmniVision's PureCel Plus stacked die technology.

"Consumers continue to demand ever-higher resolution in high end and mainstream mobile phones," said Arun Jayaseelan, senior marketing manager at OmniVision. "The OV48B features premium resolution and image quality that is ideal for both high end and mainstream smartphones. Its 0.8 micron pixels provide 48 MP resolution in the industry's smallest die size, enabling a 1/2" optical format."

The OV48B integrates an on-chip 4-cell color filter array and hardware re-mosaic, which provides high quality, 48 MP Bayer output in real time. In low light conditions, this sensor can use near-pixel binning to output a 12 MP image with four times the sensitivity.

This new sensor also features both DPHY and CPHY MIPI interfaces, which enables fast frame rates using fewer pins. Additionally, the OV48B includes 2x2 microlens phase detection autofocus (ML-PDAF) to boost accuracy, especially in low light.

Output formats include 48 MP at 10 fps with remosaic, 12 MP with 4-cell binning at 30 fps, 4K2K video at 60 fps, 1080p video at 240 fps and 720p video at 480 fps. Pad locations on the left and right of the image sensor, in combination with the industry's smallest 48 MP die size, provide smartphone camera module designers with additional flexibility.

OV48B samples are available now, and volume production is expected in Q4 2019.

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BusinessWire: Innovusion announces the availability of its Cheetah system. Based on its innovative rotating polygon optical architecture, Innovusion has melded together proprietary detector electronics, advanced optics and software algorithms.

Key features:

• Detection range of 200 meters on objects with 10% reflectivity
• Clearly detecting objects out to 280 meters
• 1550nm laser
• Resolution of 300 vertical pixels, while simultaneously maintaining a frame rate of 10Hz
• Picture like resolution of 0.13 deg over 40 deg vertical FOV and 0.14 deg resolution over 100 deg horizontal FOV.
• Power consumption under 40W, said to be the most energy efficient system of any high- performance LiDAR currently available.
• Sensor head dimension 112 mm (h) x 145 mm (w) x 105 mm(d), with a roadmap to substantially reduce the future footprint and formfactor
• Single unit price is $35,000 for small quantities

PRNewswire: Frost & Sullivan recognizes Ouster OS-1:64 LiDAR with the 2018 Price/Performance Value Leadership Award for its enhanced capabilities, durability, and power efficiency, at affordable price points and compact size.

The OS-1:64 lidar sensor's simplified architecture and 7th-generation custom silicon design can measure 1.3M points per second using less than 17W of power, a feat that was previously difficult for high-performance lidar. Additionally, it has the range to detect objects up to a distance of 120m despite being 30 times smaller than competing solutions.

"Ouster's sensors are unique among high-resolution lidar sensors as they operate at the near-infrared 850nm wavelength. Its patented light filtering technology allows it to use the 2x signal found at 850nm, while avoiding the penalty of the 5x noise that is typical to this range," said Mariano Kimbara, senior industry analyst. "The 850nm wavelength has been shown to have lower atmospheric water vapor absorption and more consistent operation compared to other available lidar operating wavelengths. This translates to an operating wavelength that is not as absorbed by humid air or fog, and a heightened sensitivity of its low-cost silicon complementary metal-oxide semiconductor (CMOS) technology."


HAL archive paper "LIDAR sensor simulation in adverse weather condition for driving assistance development" by Mokrane Hadj-Bachir and Philippe de Souza gives some performance degradation data in different weather conditions:

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An early access paper to be published in IEEE Journal on Electron Devices promises high gain in light-controlled FET: "Dynamic coupling effect in Z2 FET and its application for photodetection" by J. Liu, XY. Cao, BR. Lu, YF. Chen, A. Zaslavsky, S. Cristoloveanu, J. Wan from Fudan University, China, Brown University, USA, and INP-Grenoble/Minatec, France.

"In this paper, the application of the Z-FET (zero subthreshold swing and zero impact ionization FET) for photodetection is studied with TCAD simulation. Dynamic coupling effect is utilized to form carrier injection barriers in the partially depleted silicon-on-insulator (PD-SOI) film. Photoelectron accumulation at the front gate interface lowers the hole injection barrier and modulates the turn-on voltage. The light-triggering threshold of the device can be tuned by the front gate voltage, which controls the injection barrier height. We explore two operation modes suited to different applications, and demonstrate the operation of a one-transistor active pixel sensor array. Unlike other image sensors that utilize only one type of carrier, the Z-FET photodetector uses photo-generated holes to induce high electron currents through internal amplification, leading to a high sensitivity of up to 1.8e5 e-/(lux∙s)."

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ST promotes VG6768+STV0971 sensor - ISP combo for e-mirror and ADAS:

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Nikkei, Reuters, Financial Times: Daniel Loeb, the activist investor behind hedge fund Third Point that has invested $1.5b in Sony, is calling the company to spin off its semiconductor business.

In the year ended in March, the semiconductor unit accounted for 16% of Sony’s total operating profit of roughly $8b.

"When you think of Sony, you think of the Walkman, you think of the consumer electronics business, you know they own a movie studio and some music, but you don't think of them as a Japanese national champion in technology, with a $20 billion going to $35 billion valuation business in sensors," Loeb told the Financial Times. As of now, the whole Sony company is valued at about $62b.

Reuters also quotes valid reasons to reject the spin-off demand, though."For one, some 90% of Sony’s chips revenue comes from smartphones, Macquarie analysts reckon. That makes the business vulnerable as a tech cold war between Washington and Beijing escalates. Huawei, the Chinese titan that has been banned from working with U.S. tech firms, is a major Sony customer, for instance. Analysts at Jefferies recently slashed their operating profit forecast for the Japanese chips unit by 45% as a result.

The longer-term outlook looks shinier. Global smartphone sales are falling, but the number of cameras per phone is going up. Sony will also benefit as automakers and consumers embrace autonomous driving, which will require cars to be equipped with ever more image sensors."

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Yole Developpement report "Image Signal Processor and Vision Processor Market and Technology Trends 2019" tells:

"AI has completely disrupted hardware in vision systems, and has had an impact on entire segments, as Mobileye has in automotive, for example. Image analysis adds a lot of value. Image sensor builders are therefore increasingly interested in integrating a software layer to their system in order to capture it. Today, image sensors must go beyond taking images – they must be able to analyze them.

However, to run these types of software, high power computing and memory are necessary, which led to the creation and development of vision processors. The ISP market offers a steady compound annual growth rate (CAGR) from 2018 to 2024 of 3%, making the total market worth $4.2B in 2024. Meanwhile, the vision processor market is exploding, with a 18% CAGR from 2018 to 2024, making the market worth $14.5B in 2024!

It is important to note that historical players have struggled to react to AI’s arrival. That has allowed other companies to get into the business, including smartphone companies like Apple and Huawei, startups like Mobileye, and companies in other segments, like NVIDIA in automotive applications. However, because the trend is towards low-power, low-consumption, always-on computing hardware, the historical players are coming back into the game."

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Jim Janesick is a Distinguished Engineer at Sarnoff Inc., developing high-performance CMOS imagers for various scientific and government projects. In the beginning of his career Jim was with the Jet Propulsion Lab for 22 years, where he was group leader of the Advanced CCD Sensors Development Group with a focus on scientific CCD test and characterization. He pioneered scientific CCD and support electronic designs for several NASA space-borne imaging systems. Jim authored the text books Scientific Charge-Coupled Devices and Photon Transfer.

He received the NASA Exceptional Engineering Achievement Medal in 1982 and 1992. Over his career, he has had a great impact on characterization methodology of image sensors, particularly for scientific devices but applicable to nearly every CCD and CMOS imager.

For example, while at JPL, Jim developed the Photon Transfer Curve (PTC), world famous among image sensor technologists. This characterization method for image sensors makes it possible to characterize an imager without knowing particular details of the device. The technique is used in academia as well as in industry, and many devices are tested daily around the world making use of the PTC method.

The International Image Sensor Society is pleased to recognize Jim’s contribution to the imaging technology field by presenting him with the 2019 IISS Lifetime Achievement Award at the 2019 IISW at Snowbird in June.

Congratulations and thank you Jim!

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EuerekaAlert points to OSA Optical Materials Express paper "Geometry-controllable micro-optics with laser catapulting" by Salvatore Surdo, Alberto Diaspro, and Martí Duocastella from Istituto Italiano di Tecnologia, Genova.

"Individual or arrayed microlenses offer remarkable opportunities in optics and photonics. However, their usage is currently limited by the lack of manufacturing technologies capable of tailoring the lens geometry to target devices. Here, we demonstrate how laser catapulting (LCP), a recent laser-based additive manufacturing technique, enables the preparation of microlenses with controlled geometry and curvature. LCP exploits single laser pulses to catapult polymeric microdisks into user-selectable positions on a substrate, which are converted into microlenses following a thermal reflow treatment. By shaping the irradiance distribution of the incident laser beam, we obtained arrays of circular, triangular, and cylindrical microlenses with a radius between 50-250 µm and 100% fill-factor. The good quantitative agreement between beam shape and microlens geometry, combined with the in-situ fabrication capabilities and high-throughput of LCP, can help the consolidation of laser additive methods for micro-optics in scientific and industrial applications."

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GlobeNewswire: A year after the first announcement, Teledyne e2v and TowerJazz say that Teledyne e2v’s Emerald 67M image sensor is now available.

The sensor is a member of Teledyne e2v’s Emerald family and features TowerJazz’s smallest 2.5µm low-noise global shutter pixel, on TowerJazz’s 65nm platform, in its Uozu, 300mm Japanese manufacturing facility. The pixel is integrated with a unique light pipe technology, offering wide angular response, more than 80dB shutter efficiency, in a small size, and extremely low noise of 1e-.

Special features include HDR modes with up to 120dB DR and also a ROI mode which allows multiple ROI to be captured under different exposure conditions, further improving the DR of an image.

Emerald 67M has a square shape with 8k resolution per side, enabling 95% utilization of the image area for the next generation of display manufacturing, gen 10.5. The high resolution optimizes vision system movements in large product inspection, reducing system complexity and removing instabilities. It is available in two different speed grades (ultra-high speed, 60fps and high speed, 30fps).

Rafael Romay, VP of Professional Imaging at Teledyne e2v, said “The Emerald 67M is the first sensor of its kind and is enjoying strong interest in inspection applications due to its ultra-high resolution and fast speed. It also shares many of the smart features within other Emerald sensors making it easier to deploy within vision systems. The great technology innovation and support from TowerJazz allowed us to bring to market this best-in-class solution, customized to product and application needs.”

Avi Strum, TowerJazz SVP and GM of the Sensor BU said, “Teledyne e2v’s design and supply chain along with TowerJazz’s state of the art 65nm process have again brought a game changing sensor to machine vision applications. We are proud to have developed this together and look forward to further collaboration with Teledyne e2v to serve the machine vision market.”

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NovusLight, IMV Europe: Emberion is launching a VIS-SWIR graphene photodetector at Laser World of Photonics, to be held on June 24-27 June in Munich, Germany. The technology has been shortlisted for an innovation award at the trade fair.

The linear array wide spectral range spans from the visible at 400nm into SWIR up to 1,800nm. Emberion estimates that replacing a system using silicon and InGaAs sensors with its graphene photodetector would result in a 30% cost reduction.

“Graphene’s unique properties and its compatibility to combine with other nanomaterials allowed us to create this cost-effective array for spectrometers,” explained Tapani Ryhänen, CEO of Emberion. “Providing broad spectrum capabilities, without the expense of traditional InGaAs sensors, the VIS-SWIR graphene photodetector provides a digital output using Emberion’s inhouse designed read out circuits (ROIC) — without the need to translate analogue data with additional components.

With sensitivity and noise levels comparable to InGaAs detectors, our graphene-based sensors are a more affordable option for businesses who were previously faced with costly products.”

The detector cannot compete with silicon CMOS for visible light detection, Dr Vuokko Lantz, product manager at Emberion, told IMV Europe in an article about hyperspectral imaging. But to extend into the shortwave infrared, the graphene photodetector becomes ‘a very interesting alternative’, Lantz said.

Lantz added: ‘Our detector can offer similar performance to InGaAs in the near and shortware infrared region, and we outperform InGaAs in the visible region.’


InVision publishes Emberion article: "The first commercial product utilizing this technology is a 512×1 linear array sensor with a 16bit digital output. The pixel geometry (25×500µm) follows the conventional requirements of the spectrometer systems. The VIS-SWIR linear array sensor will be available in September 2019. The linear array will be followed by a VGA (512×640) image sensor product available in spring 2020. The image sensor has versatile applications, e.g. in machine/night vision and hyperspectral imaging."

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