TechInsights Reviews Pixel Isolation Structures

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TechInsights keeps publishing parts from Ray Fontaine's presentation at IISW 2017. The third part reviews modern pixel-to-pixel crosstalk reduction measures: Front-DTI and Back-DTI:


Sony dielectric-filled B-DTI structure from the 1.4 µm pixel featuring a 2.9 µm thick substrate extends to a depth of 1.9 µm from the back surface, although it extends to a depth of 2.4 µm deep at B-DTI intersections:


Samsung 1.12 µm pixel generation B-DTI trenches extend 1.3 µm deep into a 2.6 µm deep substrate:


Omnivision 1.0 µm pixel B-DTI extends 0.45 µm deep into the back surface of a 2.5 µm thick substrate:

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