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EETimes' Junko Yoshida publishes an interview with Soitec CEO Paul Boudre. The company now offers SOI wafers for imaging, in addition to its more traditional applications:
"Soitec sees a growing opportunity for its Imager-SOI. Without naming any customers, Soitec listed a number of advantages of Imager-SOI. These include the ability to lower NIR illuminator power consumption, better performance through increased signal to noise ratio, and keeping cost down — because of its “lower die size” compared to bulk for the same resolution."
One should note that the first reports about Soitec plans to make on imaging-optimized wafers appeared in 2013.
EEJournal publishes an article on Soitec wafer types and their differences:
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