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e2v Onyx CMOS sensor was awarded Gold by the judges of the annual Vision Systems Design Innovators Awards program. The judging panel consisted of esteemed experts from system integrator and end-user companies. The Onyx 1.3MP high speed CMOS sensor allows discernible images to be produced at extremely low light levels and through diffusing environments (e.g. fog and smoke) by range-gating for use in Intelligent Traffic Systems (ITS) and security cameras.

Gareth Powell, CMOS Sensors Marketing Manager at e2v, comments, “We are very proud to receive recognition for our innovative CMOS capabilities that make our sensors stand out from the crowd. Our heritage and expertise in imaging technology enables us to differentiate our products with unique features and functions that our customers can exploit to add real value to their end products.”

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Varioptic, a Business Unit of Parrot Drones SAS, announces a new variable focus liquid lens with extended operating temperature range, the Arctic 25H series.

“This lens benefits from the latest improvements in the Liquid Lens technology – in addition to unique resistance to mechanical shocks and vibrations, our lens features now an operating temperature which will allow us to broaden the number of applications using our technology, as well as qualification standards in line with the toughest standards of the industry,” says Samuel Grand, Varioptic Business Unit Director.

“The feedback from our beta testers is extremely positive, this new liquid lens will open new markets for Varioptic which we could not reach today, such as the growing automotive camera business,” says Frédéric Laune, Varioptic Sales & Marketing Director

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The open source Sensor journal publishes a sub-electron sensitive image sensor paper "The DEPFET Sensor-Amplifier Structure: A Method to Beat 1/f Noise and Reach Sub-Electron Noise in Pixel Detectors" by Gerhard Lutz, Matteo Porro, Stefan Aschauer, Stefan Wölfel, and Lothar Strüder from 1 PNSENSOR GmbH, München D-81739, Germany.

"The repetitive non-destructive readout (RNDR) DEPFET is an ideal central element for an active pixel sensor (APS) pixel. The theory has been derived thoroughly and results have been verified on RNDR-DEPFET prototypes. A charge measurement precision of 0.18 electrons has been achieved. The device is well-suited for spectroscopic X-ray imaging and for optical photon counting in pixel sensors, even at high photon numbers in the same cell."

The concept of a DEPFET: The signal electrons are collected in a potential minimum (internal gate) located below the channel of a FET located on top of the fully depleted bulk.

Thanks to BB for the link!

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PRNewswire: Cadence announces the Tensilica Vision P6 DSP extending the Tensilica product portfolio into the fast-growing vision/deep learning applications areas. New instructions, increased math throughput and other enhancements set a new standard in imaging and computer vision benchmarks, increasing performance by up to 4X compared to the Tensilica Vision P5 DSP.

"Cadence is investing heavily on advanced vision and deep learning," said Chris Rowen, CTO for the IP Group at Cadence. "We are devoting intense efforts to discovering improved structures and training for neural networks, providing rich software environments for fast application development and offering breakthrough vision DSP architectures for embedded vision and learning deployment. The Tensilica Vision P6 design is the direct result of this investment and significantly raises the bar in both vision efficiency and scalability."

"Devices that are more aware of the world around them are more capable, more autonomous, safer and easier to use," said Jeff Bier, founder of the Embedded Vision Alliance. "By enabling widespread deployment of deep learning and computer vision, processors like the Tensilica Vision P6 DSP are making the promise of more intelligent devices a reality."

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Cnpals publishes an article "Who Will Become the Mobileye in China?" There is quite a number of Chinese companies working on intelligent ADAS cameras:

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PRNewswire: Frost & Sullivan recognizes PMD with the 2016 European Frost & Sullivan Award for Technology Innovation. pmd's ToF technology employs a combination of its patented suppression of background illumination (SBI) technology and an on-chip application processing feature. The SBI technology distinguishes active light transmitted from the object against other non-correlated light sources such as sunlight.

The on-board application processing feature sets pmd's ToF technology apart from peer solutions, as it helps ToF sensors capture depth image without the use of a separate application processing unit. "By enabling intelligent processing of ToF images on a single chip, pmd is able to deliver an extremely efficient and high-resolution ToF system, in which the illuminator and the image sensor can be placed as close as possible," said Frost & Sullivan Research Analyst Karthik Vishal Lakshmanan. "This gives ToF chips an extremely small form factor for easy deployment in smartphones and tablets."

Furthermore, the resolution of pmd's ToF solution is said to be highly scalable. The imager can enable one pixel or a few pixels, up to its full capacity of 100K pixels. The ToF system can be easily tuned to any resolution in between through software control.

It will be used later this year in smartphones and tablets, from 2017 the technology will see immense application in augmented reality and virtual reality systems, and from 2018 for in-vehicle warning systems as well as vehicle navigation systems.

Significantly, as this ToF technology does not require a vast external application processor, it consumes much less power than competing solutions. This makes pmd's ToF solution well suited for low-power applications.

Owing to its technological achievements in the ToF sensors market and its ability to cultivate application opportunities, pmdtechnologies ag is said to fully earn Frost & Sullivan's 2016 European New Technology Innovation Award for 3-D ToF sensor technology.


Update: EleTimes publishes Infineon article on automotive use of its REAL3 ToF sensors, based on PMD technology.

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IS&T Electronic Imaging Symposium publishes GoPro's T. Macmillan and D. Newman presentation on Cinematic Camera Arrays, which might become a big market for image sensors:

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Hitachi iSee air conditioners use image sensors to directs cool air towards people, based on face detection:

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MarketWired: Movidius introduces the powerful deep learning vision processing accelerator that fits into a USB Stick. It connects to existing systems and increases the performance of neural networking tasks by 20-30X. It performs at over 150GFLOPS while consuming under 1.2W.

Called Fathom, it targets developers, researchers, hobbyists and anyone developing deep learning applications.

Facebook's Director of Artificial Intelligence Yann LeCunn has said this about Fathom: “The Fathom neural compute stick is a compact, low-power deep learning accelerator for embedded applications that is quite unique. As a researcher and builder of intelligent machines, I've been dreaming of getting my hands on something like the Fathom USB key for a long time”.

Movidius CEO, Remi El-Ouazzane says: “It’s going to mean that very soon, consumers are going to be introduced to surprisingly smart applications and products. It means the same level of surprise and delight we saw at the beginning of the smartphone revolution; we’re going to see again with the machine intelligence revolution. With more than 1 million units of Myriad 2 already ordered, we want to make our VPU the de-facto standard when it comes to embedded deep neural network.”


Movidius publishes a Youtube video presenting the new product:

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SeekingAlpha's ST Q1 2016 Earnings Call transcript has few words on its imaging business, primarily in Q&A section:

Günther Hollfelder - Baader Bank AG:

First question is on imaging systems, so what sort of sales level do you expect for imaging systems in 2016, and what sort of related loss this year for this business?

Carlo Bozotti - ST President & CEO:

I think we expect, first of all, the sequential improvement in the top line on our business, on imaging. And also an year-over-year improvement broad comparing Q2 2016 to Q2 2015, as I said before. And moving on during the course of 2016, we see additional opportunity for both sequential and year-over-year growth. As far as profitability performance, we do not provide the performance, we do not provide the quantification at the division level, but we see some good opportunities, and we see the evolution of this business also in terms of financial performance with a degree of optimism.

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Sony announces annual results for its fiscal 2015 year ended on March 31, 2016.


Update: SeekingAlpha earnings call transcript gives some info about Kumamoto TEC smartphone products:

"Looking forward to fiscal year '16, our target is to record a profit. A portion of the image sensors used in our smartphones and a portion of camera modules used in our smartphones are made at Kumamoto TEC and there is a possibility that the status of these production lines might have an adverse impact on the results of this business."

On the image sensor and camera module business, Sony says:

"An operating loss of ¥28.6 billion was recorded in fiscal year '15, significant deterioration of ¥117.6 billion compared to the previous fiscal year. As we announced last week, we recorded ¥59.6 billion impairment charge against fixed assets in the camera module business in the fourth quarter.

We first entered the camera module business in the later part of fiscal year '13. However, our ramp in manufacturing has been slower than expected, and we recorded a large impairment charges as a result.

We thought that we could increase yields and profit margins through automation of the assembly process. But, precisely because we did increase automation, we have limited ability to adapt to changes in specifications and demand. Currently, we are re‐considering the optimal size of this business.

In the image sensor business, which account for the majority of sales and profit in the devices segment, we are currently expanding our sales efforts, primarily to Chinese smartphone manufacturers, and orders are strong, but demand is not expected to recover in earnest until the second half of the fiscal year '16."

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Sony updates on the Kumamoto fab status today: Operations at Sony's Kumamoto Technology Center (located in Kikuchi Gun, Kumamoto Prefecture), which is the primary manufacturing site of image sensors for digital cameras and security cameras, were halted and currently remain suspended. With aftershocks continuing and employee safety the foremost priority, inspections of the facility and the development of a recovery plan remain ongoing. The current status of operations for the Kumamoto Technology Center is as follows:

• Damage to the building itself has been confirmed to be primarily to the upper layer of the building, and reinforcement work will be carried out in this area.
• The clean rooms used for wafer processing and manufacturing equipment, both located on the lower layer of the building have not been significantly damaged, and preparations are now underway to resume production. Manufacturing operations are targeted to resume around the end of May 2016.
• Regarding back-end processes, such as assembly and measurement, as well as processing operations for components such as camera modules, which are carried out on the upper layer of the building, Sony has confirmed that there is damage to the clean rooms, manufacturing equipment and other equipment. Further analysis of the extent of this damage is currently underway.
• Damage to finished product inventory such as image sensors at Kumamoto Technology Center is limited, and shipments of these products have already resumed. The status of semi-finished and uncompleted products is currently being confirmed.

The impact of the earthquakes on Sony Corporation's consolidated results continues to be evaluated. In the Devices segment, there is expected to be direct physical damage to Kumamoto Technology Center. Sony expects to incur expenses primarily for recovery and reinforcement work in response to the physical damage to the relevant portion of the Kumamoto Technology Center. Sony may also incur large opportunity losses, mainly in the Devices and Imaging Products & Solutions segments due to suspension of production for a certain period of time.

In addition, due to the suspension of manufacturing operations at Kumamoto Technology Center and potential disruption to the supply of components to Sony from certain third-party suppliers that also have manufacturing facilities in the Kumamoto region, it is possible that business operations within the Mobile Communications, Game & Network Services and Home Entertainment & Sound segments also may be affected. This potential impact is currently being evaluated.

Update: SeekingAlpha earnings call transcript explains more on the fab structure:

"Kumamoto TEC is extremely close to the epicenter of the - the largest earthquake that happened on April 16. It is a primary manufacturing site for image sensors for digital cameras and security cameras, as well as for the micro displays that go into projectors.

Kumamoto TEC has a bilayer structure with clean rooms in each layer. The clean rooms in the lower layer contain our wafer processing equipment and the clean rooms in the upper layer contain our testing equipment, camera module production equipment and other equipment.

The clean rooms in the lower layer, and the production treatment inside these clean rooms have not sustained significant damage. Since yesterday we have begun to start‐up the equipment in those clean rooms, and we expect to resume production in these rooms around the end of May.

On the other hand, the upper layer clean rooms did sustain damage and we are not able to say yet when we will restart operations. Damage to Kumamoto TEC's finished goods inventory is limited, and we are currently inspecting the status of its work‐in‐ progress inventory.

In the Devices segment, we expect there to be direct physical damage to Kumamoto TEC, and we expect to incur expenses primarily for recovery and reinforcement work. In addition, there is a possibility that large opportunity losses will be incurred, mainly in the Devices and Imaging Products & Solutions segments due to suspension of production at Kumamoto for a certain period of time."

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Photonics publishes a hyperspectral imaging video introduction by Greg Staples from Bayspec:

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BusinessWire: Tucsen and Gpixel launch the Dhyana 95, a 95% QE camera utilizing BSI sensor technology.

Gpixel has commenced sampling of GSENSE400BSI-TVISB, an upgrade of its existing BSI sensor. The new version of the sensor offers a high QE of 95% at 580nm.

The Dhyana 95 with 2K x 2K resolution, 11um square pixel and readout noise of only 1.3 electrons, represents a viable alternative to EMCCD based cameras.

With 100,000 electron full well capacity and 93dB dynamic range, the Dhyana 95 provides excellent image quality in high contrast applications, at up to 35fps full frame and greater than 100fps at 1K x 1K resolution. Dark noise is minimized through -25℃ cooling of the hermetic sensor chamber.

Tucsen plans to release both cooled and uncooled versions of Dhyana 95 to meet the diverse needs of a broad range of users.

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FLIR publishes a Youtube video on high speed thermal camera and its applications:

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Gizmodo, The Verge, ABC: The US President Obama and German Chancellor Merkel visited the Hannovermesse and tried on a Google Cardboard with pmd CamBoard pico flexx + handtracking Software from gestigon.

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FLIR's VP Dan Walker presents Boson, an intelligent LWIR camera module with Movidius vision processor, in the Youtube video:

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Digitimes Research expects the car-use image sensor market to grow from US$440 million in 2015 to US$900 million in 2020. n the short term, from 2016-2018, most countries will include automatic emergency braking systems as an item for evaluating car safety, and in 2018 night sensor functions are expected to be included. As for the long term, by 2035, one in every four cars will feature semi-automatic or full-automatic driving technology and each of these cars will use up to 19 image sensors.

Sony's developments for car-use image sensor are focusing maintaining stable black level in high-temperature environments, reducing signal noise, developing high dynamic range imaging and enhancing image recognition in bad weather.

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Chipworks publishes Samsung Galaxy S7 Edge teardown slides, a part of them devoted to its cameras:

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Sony publishes few more details on Kumamoto fab damage assessment after April 14, 2016 and subsequent earthquakes:

"Operations at Sony Semiconductor Manufacturing Corporation's Kumamoto Technology Center (located in Kikuchi Gun, Kumamoto Prefecture) were halted after the earthquakes and remain suspended. The extent of the damage caused by the earthquakes is being evaluated and preparations for the rehabilitation of the site are underway, with priority being placed on the safety of employees. Measures to minimize the impact on business operations are also under consideration.

The survey of damage to the Kumamoto Technology Center conducted so far has revealed damage to certain parts of the building, clean rooms and production equipment. The timeframe for resuming operations has yet to be determined. The Kumamoto Technology Center is the primary manufacturing site for image sensors for digital cameras and security cameras as well as for micro-display devices.

The impact of the earthquakes on Sony's consolidated results continues to be evaluated. The suspension of operations at the Kumamoto Technology Center may have an adverse impact on Sony's operating results, particularly in the Devices and Imaging Products & Solutions segments. In addition, the earthquakes have caused damage to the manufacturing facilities of certain third-party suppliers of components to Sony, the impact of which on Sony's business operations is currently being evaluated."

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Sony records an impairment charge in operating income of 59.6 billion yen related to long-lived assets in its camera module business.

Due to a decrease in projected future demand, Sony has revised its Mid-Range Plan for the camera module business in the Devices segment from the period beginning with the fiscal year ending March 31, 2017. Given the decrease in projected future demand, Sony performed an impairment analysis during the quarter ended March 31, 2016 and determined that future cash flows would not be sufficient to recover the entire carrying amount of the long-lived assets, leading to the recording of an impairment charge of 59.6 billion yen.

The earthquake of April 14, 2016 and subsequent earthquakes in the Kumamoto region have no impact on the consolidated financial results forecast for the fiscal year ended March 31, 2016. The impact on the consolidated financial results forecast for the fiscal year ending March 31, 2017 is currently being evaluated.

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Adimec demonstrated CCD camera and latest generation (Sony IMX250) CMOS based camera with and without color in low light.

On the left side of the company's Youtube video is the Adimec TMX7-DHD cameras (top is color and bottom is monochrome) using the Sony 2/3-inch ICX674 CCD image sensor with 4.54um pixel. On the right side is the Adimec TMX50 cameras (again top is color and bottom is monochrome) using the latest Sony 2/3-inch global shutter CMOS sensor IMX250 with 3.45um pixel. The TMX50 image is interpolated to match TMX7-DHD resolution of 1920x1080.

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Robert Stead, the founder of Sense Media organizing AutoSens conference, teams up with Patrick Denny of Valeo, Sven Fleck at SmartSurv, Benjamin May at AMX13, and a number of other professionals to submit IEEE Project Authorisation Request (PAR), Proposed Project 2020: Automotive System Image Quality.

From the submitted PAR:

5.2 Scope: This standard addresses the fundamental attributes that contribute to image and quality for automotive Advanced Driver Assistance Systems (ADAS) applications, as well as identifying existing metrics and other useful information relating to these attributes. It defines a standardized suite of objective and subjective test methods for measuring automotive camera image quality attributes, and it specifies tools and test methods to facilitate standards-based communication and comparison among OEM and Tier 1 system integrators and component vendors regarding automotive ADAS image quality.

5.4 Purpose: This standard specifies methods and metrics for measuring and testing automotive image quality to ensure consistency and create cross-industry reference points.

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The mysterious $3.7b-valued AR startup Magic Leap publishes another Youtube video "A New Morning. Welcome to a new way to start your day. Shot directly through Magic Leap technology on April 8, 2016 without use of special effects or compositing:"

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Point Grey publishes a nice comparison of Sony and Aptina global shutter sensor, including the latest Sony 3.45um pixel size IMX250 and IMX265. One can see them compared with 5.86um pixel in Sony IMX174 and IMX249 and Aptina's 3.75um pixel in AR0134:

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Pixpolar publishes a whitepaper on low light imaging for security & surveillance:

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Intel publishes a Youtube video promoting its RealSense 3D cameras and REAL 2016 exhibition:

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Albert Theuwissen has updated the PDAF pixel report and included a figure-of-merit for PDAF. This FoM allows the reader to compare the efficiency of the PDAF pixels coming from different sensors, different technologies and different vendors. Also a couple of new references are added to list.

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ALA: Sofradir announces that its cost effective 3-4.8um MWIR Daphnis HD imager will enter production. The 10-micron pixel pitch high-definition IR detector claims superior performance against recently launched competitive 10µm products.

“Thanks to the sharp square like profile of its Mercury Cadmium Telluride photodiode and enlarged MW band, DAPHNIS offers improved recognition range versus any competing 10µm pitch products we have recently seen introduced in the market” says Laurent Fullana, general manager at Sofradir. “This elevates DAPHNIS to the product of choice for applications like gimbals, high-end vehicles sights and Infrared search and track systems. Moreover, the ability to obtain an HD image format from a detector whose size fits previous platform generations is a real benefit as it facilitates customer system upgrades.”

The new imager features:

• Higher resolution, 1280 x 720 pixels
• Longer range, achieves up to 55% DRI range improvement on the preceding generation of IR detectors
• Wider field of view, enables up to twice the field coverage of 15 micron pixel pitch MWIR detectors
• ROIC functionalities with digital output for easy integration
• Fully compatible with HD screen formats and visible or SWIR camera channels

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Daedal Research publishes "Global Dual Lens Smartphone Market: Trends & Opportunities (2016-2020)" research:

"For the span of next five years i.e. 2016-2020, projections are made that the market would rise tremendously at a significant CAGR. China is expected to lead the market accounting the significant share in the market.

The growth drivers for the global dual lens smartphone market are: expansion in fusion technology, production capacity expansion along with the rise in disposable income. Despite the market is governed by various growth drivers, there are certain challenges faced by the market such as: technological hurdles, stable sourcing of image sensor and migration to finer processes for image sensors, high-cost burdens, and algorithms."

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