Visual Industry Guide
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ETH Zurich team publishes a video summary of their 2021 International Image Sensor Workshop paper “Unravelling the paradox of intensity-dependent DVS noise,” by R. Graca and T. Delbruck.Image Sensors World Go to the original article...
International Image Sensors Workshop 2021 starts on September 20. It's held in virtual space this year. The workshop materials are available on-line starting from September 13, just in a couple of days. Therethore, there are just a few days left to register. The registration fee is only $100, the lowest ever!
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SmartSens releases the 1/3-inch, 2MP SC2336 and 1/2.8-inch, 3MP SC3336—two performance upgrade CMOS sensors with DSI-2 technology, aiming at surveillance and automotive camera applications. Benefiting from PixGain technology, the SC3336 supports High Gain and Low Gain to adjust to light changes between day and night.
Both SC2336 and SC3336 are equipped with an ultra-low-noise readout, combined with cinema-level color visual effects technology for more detailed and more realistic night vision full-color imaging. Taking SC2336's Chroma as an example, the low color temperature increased by 15% , and the high color temperature increased by 11.8%.
In addition, the electrical crosstalk (Blooming) of SC2336 and SC3336 is significantly reduced by 45% and 35% , respectively , compared with the previous generation products, which improves the flashing that is easily generated by the camera in backlit scenes and night shooting lights.
The SC2336 has achieved mass production and the SC3336 is available for sampling now, with mass production expected in Q4 of 2021.
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STMicroelectronics announces its first multi-zone FlightSense dToF sensor for general-purpose applications. The VL53L5CX sensor provides up to 64 sensing zones with multi-target detection, distance measurement up to four meters in each zone, and a wide square-edged field of view with 63° diagonal.
The sensor is suited to gesture recognition, complex scene analysis including 3D room mapping for robotics, storage-tank level monitoring to assist in inventory management, liquid-level control, and waste-bin-level monitoring to enable smart refuse collection for enhanced efficiency.
Featuring ST’s histogram processing, which greatly reduces the impact of cover-glass crosstalk, the sensor can be integrated and hidden behind various types of front panels. The new motion-indicator feature allows the sensor to detect if the target has moved or not.
The number of sensing arrays is programmable and the sensor can provide up to 60 fps in 16-zone (4×4) mode for fast-ranging mode. With simple software configuration to reach high resolution of 8×8 zones, the VL53L5CX can also assist keystone correction for video projectors and provide an accurate mini depth-map for AR/VR applications.
The VL53L5CX contains a low-power microcontroller and is capable of autonomous operation for power-saving applications. It comes in a fully integrated 6.4mm x 3.0mm x 1.5mm module that contains an infrared VCSEL and a receiver with embedded SPADs and histogram based ToF processing engine.
All parts are in production now, priced from $3.90.
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Sony publishes a video presenting event-based vision sensor. The video appears to be a product presentation but does not mention any specific part number. The software processing poart is based on Prophesee Metavision suite:Image Sensors World Go to the original article...
Barry E. Burke passed away on September 7, 2021, after a long illness.
Barry was a MIT Lincoln Laboratory Fellow. For most of his nearly 49-year career, he has worked on CCDs. Among the CCDs designed by Burke are those used in the space-borne soft-X-ray astronomy missions ASCA (Advanced Satellite for Cosmology and Astrophysics), Chandra, and Suzaku. Visible-band CCDs he developed are being used in several observatories, including the Panoramic Survey Telescope and Rapid Response System (Pan-STARRS) in Hawaii. He is the co-inventor of the orthogonal-transfer CCD (OTCCD), a device which can compensate for image motion by pixel shifting and which is used in the Pan-STARRS imagers. He recently completed design work on the CCD imagers used on the Transiting Exoplanet Survey Satellite (TESS) launched in April 2018.
Dr. Burke has authored or coauthored more than 100 publications and conference proceedings and is the inventor or co-inventor on 18 patents. His last papers have been published as recently as in August 2021. He was a Fellow of the IEEE.
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Samsung ISSCC 2021 presentation "1/2.74” 32 Megapixel-Prototype CMOS Image Sensor with 0.64μm Unit Pixels Separated by Full-Depth Deep-Trench Isolation" with a list of 32 authors Jongeun Park, Sungbong Park, Kwansik Cho, Taehun Lee, Changkyu Lee, DongHyun Kim, Beomsuk Lee, SungIn Kim, Ho-Chul Ji, DongMo Im, Haeyong Park, Jinyoung Kim, JungHo Cha, Taehoon Kim, In-Sung Joe, Soojin Hong, Chongkwang Chang, Jingyun Kim, WooGwan Shim, Taehee Kim, Jamie Lee, Donghyuk Park, EuiYeol Kim, Howoo Park, Jaekyu Lee, Yitae Kim, JungChak Ahn, YoungKi Hong, ChungSam Jun, HyunChul Kim, Chang-Rok Moon, and Ho-Kyu Kang is available one-line. Few slides:
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YahooTaiwan, UnitedDailyNews, Digitimes, SinaFinance: Omnivision reduces its 2022 foundry orders by 50,000 wafers per month. Reportedly, the main reason is the weakness of the smartphone market in China.Image Sensors World Go to the original article...
Samsung SVP & Head of Automotive Sensors Haechang Lee presented the company's small pixel history and roadmap at SEMI Europe Summit on Sept. 1, 2021. The 576MP mobile sensor is planned for 2025:
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SEMI Europe Summit publishes a couple of slides from the presentations including Samsung prediction about LiDAR market:
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SUSS MicroTec and SET signed a joint development agreement to develop a cluster, including several modules such as surface preparation, cleaning, bonding and metrology.
As part of this partnership, SUSS MicroTec’s high-efficiency surface preparation modules and throughput-optimized metrology solutions for post bond overlay verification will be combined with SET’s latest ultra-high accuracy D2W hybrid bonding platform.
Goetz M. Bendele, CEO of SUSS MicroTec, says: “With our partnership with SET, we will be able to offer our customers a complete suite of both die-to-wafer and wafer-to-wafer hybrid bonding solutions for the broadest set of heterogeneous integration applications in the advanced backend space. Our die-to-wafer bonding solution, leveraging the combination of SET’s leading-precision die placement technology with SUSS’s proven surface activation, automation, and metrology capabilities, will deliver additional customer value through differentiation in terms of throughput and yield, while at the same time enabling friction-less integration into our customers’ fabrication sites.”
Pascal Metzger, CEO of SET, says: “Thanks to several partnerships we had & our more than 10 years experience in hybrid bonding, we have succeeded in taking hybrid bonding from a purely laboratory state to an industrial state. Thus in September 2019, SET launched a stand-alone machine – the NEO HB. Thanks to our new partnership with SUSS MicroTec, we are now going to accelerate the integration and automation phase of the process.”
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8th Harvest Imaging Forum is to be held on December 9-10, 2021 in Delft, the Netherlands. The Forum will be a hybrid one meaning that both in-person and remote attendances are possible:
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BusinessWire: Samsung introduces the ISOCELL GN5, the first image sensor to adopt all-directional focusing Dual Pixel Pro technology with two photodiodes in a single 1.0μm pixel.
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GadgetsNow quotes Balajee Sowrirajan, MD of Samsung Semiconductor India Research (SSIR), saying that Samsung’s R&D center in Bengaluru, India, led the development of the mobile 108MP ISOCELL HMX sensor launched two years ago.
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ALANews: Lynred unveils the ATI320, its first advanced thermal imager with embedded image signal processing. The product’s embedded features, with a lens available as an option, aim at saving camera makers time and effort in integrating thermal imaging during the development and manufacturing process, enabling them to speed products to market.Image Sensors World Go to the original article...
EastMoney, MooreElite, Laoyaoba publish a glorified history of Galaxycore from early days to IPO. Few quotes:
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Gpixel announces a high-speed global shutter sensor, GSPRINT4510, a new member of GSPRINT series targeting high speed applications.
GSPRINT4510 is a 10MP 4/3” (22.9mm) sensor based on 4.5 µm charge domain global shutter pixel. It has more than 30 ke- full well and less than 3 e- rms read noise. Using an advanced 65 nm CIS process with light pipe technology, the sensor achieves >65% QE and more than 1/40,000 shutter efficiency. With on-chip charge binning, full well capacity can be further increased and frame rate is almost quadrupled.
GSPRINT4510 will be offered in two variants to support in the most optimal way different end-use use cases. One version is dedicated to 3D laser profiling and supports 144 pairs sub-LVDS channels running at 1.2Gbps each, which delivers 2000 fps in 8-bit operation at 2048 rows and >3500 fps with an ROI of 1024 rows in combination with several HDR modes. Incorporating a thinner glass lid to reduce stray light reflection, the option to have no micro lenses, and either a sealed or removable glass lid makes GSPRINT4510 a good solution for 3D laser scanning applications.
For other applications including high-speed industrial inspection, life science imaging and 4K video applications, the sensor is offered in monochrome, color and achieve up to 500 fps @ 12-bit, 1008 fps @ 10-bit and 1928 fps @ 8-bit with full resolution. On-chip 2×2 charge binning can boost frame rates more than x3 with a full well charge increase to 120 ke-. Flexible output channel multiplex modes make it possible to reduce frame and data rate to make it compatible with all available camera interface options. This version of the sensor incorporates micro lenses and a sealed glass lid making GSPRINT4510 a good choice for many applications such as 4/3”(MFT) format global shutter cameras in slow motion capture or drone-mounted videography.
Both versions of GSPRINT4510 are packaged in a 454-pin uPGA ceramic package which is pin-compatible with GSPRINT4521. GSPRINT4510 monochrome engineering samples can be ordered today for delivery in October 2021.
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Hamamatsu Photonics has developed a new profile sensor with an embedded computing function. This sensor, S15366, is specifically designed to calculate signals from the incident light spot within its processing chip and output incident light position information. Since this new profile sensor can output the incident light positions as coordinate data, it needs no external controller for computing processing.
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BusinessWire: Kasalis, an active alignment company founded in 2011 acquired by Jabil in 2015, re-launches its brand and website. "Today, we are excited to announce a new brand direction from Jabil Kasalis to simply Kasalis. We believe shifting to our established and independent brand identity will better demonstrate our distinctive value in the market." Although Kasalis remains a technology division of Jabil Inc., it appears that Jabil prepares to sell it or spin it off.
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Hamamatsu publishes a popular explanation of its photon number resolving Quest camera advantages:
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Matter publishes EPFL and Toronto University paper "Colloidal quantum dot photodetectors with 10-ns response time and 80% quantum efficiency at 1,550 nm" by Maral Vafaie, James Z.Fan, Amin Morteza Najarian, Olivier Ouellette, Laxmi Kishore Sagar, Koen Bertens, Bin Sun, F. Pelayo García de Arquer, Edward H.Sargent.
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Science publishes a review paper "Semiconductor quantum dots: Technological progress and future challenges" by F. Pelayo García de Arquer, Dmitri V. Talapin, Victor I. Klimov, Yasuhiko Arakawa, Manfred Bayer, Edward H. Sargent from University of Toronto (Canada), Barcelona Institute of Science and Technology (Spain), University of Chicago (USA), Los Alamos National Laboratory (USA), University of Tokyo (Japan), and Technische Universitat Dortmund (Germany.)
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Sony publishes an interview with its automotive image sensor designers explaining why the company is still having difficulties on this market. Few quotes:
